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Interfacial Stresses Analyses of Anisotropic Conductive Adhesive Bonding Under Thermal and Humidity Loads

โœ Scribed by Zhang, Jun; Chen, Xu; Wei, Xinli; Lin, Yong-Cheng


Book ID
111989439
Publisher
American Scientific Publishers
Year
2008
Tongue
English
Weight
97 KB
Volume
5
Category
Article
ISSN
1546-1955

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