✦ LIBER ✦
Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
✍ Scribed by D. V. Zhmurkin; T. S. Gross; L. P. Buchwalter
- Book ID
- 107457595
- Publisher
- Springer US
- Year
- 1997
- Tongue
- English
- Weight
- 1023 KB
- Volume
- 26
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.