Interfacial Reaction between Zn-Al-Based High-Temperature Solders and Ni Substrate

✍ Scribed by Yoshikazu Takaku; Komei Makino; Keita Watanabe; Ikuo Ohnuma; Ryosuke Kainuma; Yasushi Yamada; Yuji Yagi; Ikuo Nakagawa; Takashi Atsumi; Kiyohito Ishida

• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 520 KB
• Volume: 38
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-008-0528-y