✦ LIBER ✦
Interfacial microstructure and intermetallics developed in the interface between in solders and Au/Ni/Ti thin films during reflow process
✍ Scribed by Keesam Shin; Won-Gu Cho; Young-Ho Kim
- Book ID
- 107453005
- Publisher
- Springer US
- Year
- 2003
- Tongue
- English
- Weight
- 977 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0361-5235
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