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Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications

✍ Scribed by Th. Schubert; A. Brendel; K. Schmid; Th. Koeck; Ł. Ciupiński; W. Zieliński; T. Weißgärber; B. Kieback

No coin nor oath required. For personal study only.

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