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Interfacial behavior of polyimide/primer/copper system by preoxidation of the primer

โœ Scribed by Hyuncheol Kim; Jyongsik Jang


Publisher
John Wiley and Sons
Year
2000
Tongue
English
Weight
210 KB
Volume
78
Category
Article
ISSN
0021-8995

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Miscibility of polyimide with polymeric
โœ J. Yu; M. Ree; T. J. Shin; X. Wang; W. Cai; D. Zhou; K.-W. Lee ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 176 KB ๐Ÿ‘ 2 views

Poly(amic acid) (PAA) and poly(amic diethyl ester) (PAE) precursors of poly(4,4ะˆ-oxydiphenylene biphenyltetracarboximide) (BPDA-ODA PI) were synthesized. Miscibility behaviors of these precursors with poly(arylene ether benzimidazole) (PAEBI), which is a good adhesion primer for copper metal, were i