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Interfacial Adhesion and Microfailure Modes of Electrodeposited Carbon Fiber/Epoxy–PEI Composites by Microdroplet and Surface Wettability Tests

✍ Scribed by Joung-Man Park; Dae-Sik Kim; Jin-Woo Kong; Minyoung Kim; Wonho Kim; In-Seo Park


Publisher
Elsevier Science
Year
2002
Tongue
English
Weight
467 KB
Volume
249
Category
Article
ISSN
0021-9797

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✦ Synopsis


Interfacial properties and microfailure modes of electrodeposition (ED)-treated carbon fiber-reinforced polyetherimide (PEI) toughened epoxy composite were investigated using microdroplet test and the measurement of surface wettability. ED was performed to improve the interfacial shear strength (IFSS). As PEI content increased, IFSS increased due to enhanced toughness and plastic deformation of PEI. In the untreated case, IFSS increased with adding PEI content, and the IFSS of the pure PEI matrix showed the highest. On the other hand, for the ED-treated case IFSS increased with PEI content with rather low improvement rate. In the untreated case, neat epoxy resin appeared brittle microfailure mode, whereas the pure PEI matrix exhibited a more likely ductile microfailure mode. In the ED-treated case, neat epoxy exhibited a more ductile fracture than that of the untreated case. Critical surface tension and polar surface free energy of ED-treated carbon fiber was higher than those of the untreated fiber. The work of adhesion between fiber and matrix was not directly proportional to IFSS for both the untreated and ED-treated cases. The matrix toughness might contribute to IFSS more likely than the surface wettability. Interfacial properties of the epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.


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✍ Joung-Man Park; Jin-Won Kim; Dong-Jin Yoon 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 917 KB

Interfacial and microfailure properties of carbon fiber/epoxy composites were evaluated using both tensile fragmentation and compressive Broutman tests with an aid of acoustic emission (AE). A monomeric and two polymeric coupling agents were applied via the electrodeposition (ED) and the dipping app