Interface kinetics of combustion–diffusion bonding of Ni3Al/Ni and TiAl/Ti under direct current field

✍ Scribed by Chen, S. P.; Dong, F.; Fan, W. H.; Meng, Q. S.; Munir, Zuhair A.

• Book ID: 118801403
• Publisher: Springer
• Year: 2012
• Tongue: English
• Weight: 753 KB
• Volume: 48
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-012-6869-1