✦ LIBER ✦
Interface integration defect of copper and low-K materials beyond nano-scale copper damascene process
✍ Scribed by Kei-Wei Chen; Ying-Lang Wang; Jung-Chih Tsao; Yungder Juang; Feng-Yi Lee
- Book ID
- 108191500
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 430 KB
- Volume
- 69
- Category
- Article
- ISSN
- 0022-3697
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