✦ LIBER ✦
Interface fracture surface energy of sol–gel bonded silicon wafers by three-point bending
✍ Scribed by B. A. Latella; M. Ignat
- Book ID
- 106398791
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 331 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0957-4522
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