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Interdiffusion phenomena in Au/Cu and Cu/Au bilayers

✍ Scribed by J.E. Macur; R.W. Vook

Book ID
107862828
Publisher
Elsevier Science
Year
1980
Tongue
English
Weight
848 KB
Volume
66
Category
Article
ISSN
0040-6090

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## Abstract The realtime evolution of stress during deposition of Cu/Au and Au/Cu bilayers was studied by an in‐situ curvature measurement optical technique and annealing in the temperature range from room temperature to 400 Β°C. The Au/Cu and Cu/Au bilayers attached to silicon substrate with total