✦ LIBER ✦
Interdiffusion, phase formation, and stress development in Cu–Pd thin-film diffusion couples: Interface thermodynamics and mechanisms
✍ Scribed by Chakraborty, J.; Welzel, U.; Mittemeijer, E. J.
- Book ID
- 121847832
- Publisher
- American Institute of Physics
- Year
- 2008
- Tongue
- English
- Weight
- 574 KB
- Volume
- 103
- Category
- Article
- ISSN
- 0021-8979
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