Lsi/Vlsi Testability Design
β Frank F. Tsui
π Library
π
1987
π Mcgraw-Hill (Tx)
π English
β¦ LIBER β¦
π
Interconnects in VLSI Design
β Scribed by J. M. Wang, E. S. Kuh (auth.), Hartmut Grabinski (eds.)
- Publisher
- Springer US
- Year
- 2000
- Tongue
- English
- Leaves
- 233
- Edition
- 1
- Category
- Library
β¬ Acquire This Volume
No coin nor oath required. For personal study only.
β¦ Synopsis
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continuaΒ tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the desΒ cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
β¦ Table of Contents
Front Matter....Pages i-vii
Recent Development in Interconnect Modeling....Pages 1-23
Study of Parallel Plane Mode Excitation at a Double-Layer via Interconnect using the FDTD Method....Pages 25-35
A Testchip for Analysis of Signal Integrity and Ground-Bounce Effects in Deep-Submicron Technology....Pages 37-48
Measurement of Signal Integrity within Deep Sub-Micron Interconnect....Pages 49-59
Considering Magnetic Interference in Board-Level Interconnect Design....Pages 61-69
Input Shape Influence over Interconnect Performances....Pages 71-77
Comparisons of RL and RLC Interconnect Models in the Simultaneous Switching Noise Simulations....Pages 79-88
Black-Box Modeling of Digital Devices....Pages 89-100
Advanced Modeling of Nonuniform Interconnects....Pages 101-117
Modeling of Passive Components for Radio Frequency Applications....Pages 119-131
Electrical Performance of Capacitors Integrated in Multi-Layered Printed Circuit Boards....Pages 133-145
Characteristic Impedance Measurement on Silicon....Pages 147-154
Efficient Computation of the Parameters of Parallel Transmission Lines in IC Interconnects....Pages 155-179
Modeling of Optical Interconnections for Data Transmission within High-Speed Electronic Systems....Pages 181-194
Quantifying the Performance of Optoelectronic FPGAβs: The Impact of Optical Interconnect Latency....Pages 195-202
PIN CMOS Receivers for Optical Interconnects....Pages 203-212
BiCMOS Receiver OEIC for Optical Interconnects....Pages 213-220
Electrical-Optical Printed Circuit Boards: Technology - Design - Modeling....Pages 221-236
β¦ Subjects
Circuits and Systems; Electrical Engineering; Computer-Aided Engineering (CAD, CAE) and Design
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