𝔖 Bobbio Scriptorium

✦ LIBER ✦

Interconnection failure model and its stress analysis in multilayered printed wiring board : K. Natsume. Proceedings of the Second Symposium on Reliability, JUSE, Tokyo, Japan, 17–18 April (1972), p. 177. (In Japanese.)

Book ID: 103267952
Publisher: Elsevier Science
Year: 1972
Tongue: English
Weight: 114 KB
Volume: 11
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(72)90021-2

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