Interconnect layout optimization under higher order RLC model for MCM designs

✍ Scribed by Cong, J.; Cheng-Kok Koh; Madden, P.H.

• Book ID: 119778842
• Publisher: IEEE
• Year: 2001
• Tongue: English
• Weight: 264 KB
• Volume: 20
• Category: Article
• ISSN: 0278-0070
• DOI: 10.1109/43.969438