Interbody device footprint and endplate engagement characteristics: biomechanical implications

✍ Scribed by Edward C. Benzel

• Book ID: 119371426
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 62 KB
• Volume: 9
• Category: Article
• ISSN: 1529-9430
• DOI: 10.1016/j.spinee.2009.04.013