Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

✍ Scribed by Dow, Wei-Ping; Huang, Her-Shu; Lin, Zack

• Book ID: 111687206
• Publisher: The Electrochemical Society
• Year: 2003
• Tongue: English
• Weight: 628 KB
• Volume: 6
• Category: Article
• ISSN: 1099-0062
• DOI: 10.1149/1.1595311