Interaction of polyamic acids and polyamic esters with copper and substituted polysilsesquioxane copolymers

✍ Scribed by H. G. Linde

• Book ID: 101585608
• Publisher: John Wiley and Sons
• Year: 1992
• Tongue: English
• Weight: 344 KB
• Volume: 46
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/app.1992.070460216

✦ Synopsis

The interactions of biphenyldianhydride-p -phenylenediamine (BPDA-PDA) polyamic acid and ester polymers with copper and copper-treated surfaces containing polysilsesquioxanes formed from 3-aminopropyltriethoxysilane ( APS) (or copolymers of APS and phenyltriethoxysilane ) were compared by grazing-incidence infrared spectroscopy. This investigation of a flexible dianhydride-stiff diamine copolymer compliments earlier work using the stiff dianhydride-flexible diamine polyamic acid and ester of pyromellitic dianhydride-oxydianiline ( PMDA-ODA) . Results support earlier findings that amic acids form thermally labile salts on copper but esters do not. Further, while APS forms a copper-interactive film that insulates amic acid/ metal interaction, APS-phenylsilsesquioxane copolymers create an interfacial region interactive with both copper and overlying polyamic acid.