Integrity of shallow junction CMOS structures with Ti/TiN/AlSiCu and Ti/TiN/AlCu contact metallization

✍ Scribed by S. Chittipeddi; V.C. Kannan; B. Rambabu

• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 595 KB
• Volume: 38
• Category: Article
• ISSN: 0038-1101
• DOI: 10.1016/0038-1101(95)00024-n