✦ LIBER ✦
Integration of wet-chemical processing with low-temperature plasma-assisted processes for the formation of device-quality Si/SiO2 interfaces on Si(111) surfaces
✍ Scribed by T. Yasuda; C.H. Bjorkman; Y. Ma; Z. Lu; G. Lucovsky; U. Emmerichs; C. Meyer; K. Leo; H. Kurz
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 541 KB
- Volume
- 25
- Category
- Article
- ISSN
- 0167-9317
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