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Integration of copper multilevel interconnects with oxide and polymer interlevel dielectrics

✍ Scribed by Ronald J. Gutmann; T.Paul Chow; S. Lakshminarayanan; David T. Price; Joseph M. Steigerwald; Lu You; Shyam P. Murarka

Book ID: 103427180
Publisher: Elsevier Science
Year: 1995
Tongue: English
Weight: 895 KB
Volume: 270
Category: Article
ISSN: 0040-6090
DOI: 10.1016/0040-6090(96)80080-0

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