✦ LIBER ✦
Integrated data envelopment analysis and neural network model for forecasting performance of wafer fabrication operations
✍ Scribed by Chia-Yu Hsu
- Book ID
- 120675666
- Publisher
- Springer US
- Year
- 2013
- Tongue
- English
- Weight
- 609 KB
- Volume
- 25
- Category
- Article
- ISSN
- 0956-5515
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