✦ LIBER ✦
InP and Si metal-oxide semiconductor structures fabricated using oxygen plasma assisted wafer bonding
✍ Scribed by Markus Forsberg; Donato Pasquariello; Martin Camacho; David Bergman
- Book ID
- 107453044
- Publisher
- Springer US
- Year
- 2003
- Tongue
- English
- Weight
- 184 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0361-5235
No coin nor oath required. For personal study only.