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Injection moulding of tungsten- or molybdenum-copper materials for microelectronics

Book ID: 114067525
Publisher: Elsevier Science
Year: 2002
Tongue: English
Weight: 187 KB
Volume: 57
Category: Article
ISSN: 0026-0657
DOI: 10.1016/s0026-0657(02)80211-9

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Injection moulding for production of cop

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Apparatus for injection moulding article

Apparatus for injection moulding articles composed of a material in which are embedded masses of one or more other materials: Monnet, B L.∗ (Billion S.A.) US Pat 3 979 170 (7 September 1976)

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