Infrared spectroscopic study of SiOx film formation and decomposition of vinyl silane derivative by heat treatment. II. On copper surface

✍ Scribed by Hyuncheol Kim; Jyongsik Jang

• Publisher: John Wiley and Sons
• Year: 1998
• Tongue: English
• Weight: 274 KB
• Volume: 68
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/(sici)1097-4628(19980502)68:5<785::aid-app10>3.0.co;2-q

✦ Synopsis

The thermooxidative degradation and SiO x film-formation mechanism of poly (vinylimidazole-co-vinyltrimethoxysilane) [poly(VI-co-VTS)] on copper was investigated with Fourier transform infrared reflection and absorption spectroscopy (FTIR-RAS). The spectral differences of the copolymers with different coating thicknesses were compared. Thermal degradation of the copolymer was catalyzed by copper in the copolymer film as well as on the copper surface. This catalytic effect of copper was observed regardless of coating thickness. Copper in the copolymer film participated in Cu-containing SiO x film formation during thermal degradation. In addition, the enhanced heat treatment causes the film defects in Cu-containing SiO x film as a result of thermal decomposition. Copper corrosion proceeded through these film defects. However, in a thick-coated sample, copper oxides were first formed through the crack in the barrier film as a result of the residual stress. Copper oxides in the film interacted with the SiO x film to form a Cu-rich phase in the vicinity of film defects and cracks.