Infrared focal plane array storage life assessment by accelerated aging
✍ Scribed by Rolin K. Asatourian
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 125 KB
- Volume
- 14
- Category
- Article
- ISSN
- 0748-8017
No coin nor oath required. For personal study only.
✦ Synopsis
To satisfy the need for characterizing the aging process of infrared focal plane arrays (FPAs) in storage, tests were performed where FPAs were subjected to four different stress temperatures. A Weibull distribution which was fitted to the pixel failure data indicated a shape parameter of 0.97. An Arrhenius analysis showed that an activation energy of 0.76 eV is driving the aging process. Once such a device-specific degradation was characterized, a lifetime was projected for the FPA. Secondly, it was determined that under certain conditions the FPA was expected to outlive the package it was in. The model developed offered a trade-off tool to pass this 'excess' reliability of the FPA to a more life-limiting component, namely the package, thus increasing the overall product reliability of the FPA-package combination. Thirdly, a relationship between reliability and cost was established which allowed grading the price of individual units based on their expected field reliability, before they leave the factory. ©1998