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Influence of thickness on nanomechanical behavior of Black Diamond™ low dielectric thin films for interconnect and packaging applications

✍ Scribed by V. N. Sekhar; T. C. Chai; S. Balakumar; Lu Shen; S. K. Sinha; A. A. O. Tay; Seung Wook Yoon


Publisher
Springer US
Year
2008
Tongue
English
Weight
815 KB
Volume
20
Category
Article
ISSN
0957-4522

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