Influence of Thermal Processing Parameters and Material Properties on Velocity Configurations in Semiconductor Melts During the Vertical Bridgman Growth Technique

✍ Scribed by A. Bachran; P. Reinshaus; W. Seifert

• Publisher: John Wiley and Sons
• Year: 1998
• Tongue: English
• Weight: 336 KB
• Volume: 33
• Category: Article
• ISSN: 0232-1300
• DOI: 10.1002/(sici)1521-4079(1998)33:1<27::aid-crat27>3.0.co;2-o