Influence of the chip temperature on the moisture-induced failure rate of plastic-encapsulated devices : Dieter Stroehle. IEEE Trans. Components Hybrids Mfg Technol.CHMT-6 (4), 537 (December 1983)

• Book ID: 103281125
• Publisher: Elsevier Science
• Year: 1984
• Tongue: English
• Weight: 134 KB
• Volume: 24
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(84)90037-4