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Influence of the Chemicals Used in Nickel and Copper Plating Solutions on the Adhesion of Screen-printed Silver Contacts

✍ Scribed by Kraft, Achim; Ni, Limeng; Kalio, Andre; Moldovan, Anamaria; Bartsch, Jonas; Glatthaar, Markus; Glunz, Stefan W.

Book ID: 121427506
Publisher: Elsevier
Year: 2013
Weight: 658 KB
Volume: 38
Category: Article
ISSN: 1876-6102
DOI: 10.1016/j.egypro.2013.07.343

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