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Influence of the additives (TU) and (PEG) on the underpotential deposition of copper on platinum electrodes: a coulometric, microgravimetric and topographic study

✍ Scribed by M. Wünsche; R.J. Nichols; R. Schumacher; W. Beckmann; H. Meyer

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 591 KB
Volume: 38
Category: Article
ISSN: 0013-4686
DOI: 10.1016/0013-4686(93)80233-p

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