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Influence of surface chemical composition on the reliability of Al/Cu bond in electronic devices

โœ Scribed by S. Pignataro; A. Torrisi; O. Puglisi; A. Cavallaro; A. Perniciaro; G. Ferla

Book ID
107925550
Publisher
Elsevier Science
Year
1986
Tongue
English
Weight
580 KB
Volume
25
Category
Article
ISSN
0169-4332

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