Influence of pulsed DC current stress on electromigration results in AlCu interconnections; analysis of thermal and healing effects

✍ Scribed by L. Arnaud; G. Reimbold; P. Waltz

• Book ID: 108362429
• Publisher: Elsevier Science
• Year: 1999
• Tongue: English
• Weight: 922 KB
• Volume: 39
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(99)00100-6