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Influence of POSS nano-particles on Sn–3.0Ag–0.5Cu–xPOSS/Cu composite solder joints during isothermal aging

✍ Scribed by Shen, Jun; Tang, Qin; Pu, Yayun; Zhai, Dajun; Cao, Zhongming; Chen, Jie

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Influence of minor POSS molecules additi

✍ Jun Shen, Changfei Peng, Heng Gang Yin, Jie Chen 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 462 KB

Creep behavior in Cu and Ag particle-rei

✍ F. Guo; J. P. Lucas; K. N. Subramanian 📂 Article 📅 2001 🏛 Springer US 🌐 English ⚖ 376 KB

Characterization of Cu3P phase in Sn3.0A

✍ Chen, Jian-xun; Zhao, Xing-ke; Zou, Xu-chen; Huang, Ji-hua; Hu, Hai-chun; Luo, H 📂 Article 📅 2014 🏛 Springer-Verlag 🌐 English ⚖ 673 KB

Interfacial Reactions of Sn-3.0Ag-0.5Cu

✍ Chien-Fu Tseng; Kai-Jheng Wang; Jenq-Gong Duh 📂 Article 📅 2010 🏛 Springer US 🌐 English ⚖ 856 KB

Suppressing the growth of interfacial Cu

✍ Wei-Yu Chen; Chi-Yang Yu; Jenq-Gong Duh 📂 Article 📅 2012 🏛 Springer 🌐 English ⚖ 798 KB

Reaction of Sn-3.5Ag-0.7Cu-xSb solder wi

✍ Li, G.Y.; Chen, B.L.; Tey, J.N. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 1003 KB