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Influence of polymer additive molecular weight on surface and microstructural characteristics of electrodeposited copper

✍ Scribed by R MANU; SOBHA JAYAKRISHNAN

Book ID
107582414
Publisher
Springer-Verlag
Year
2011
Tongue
English
Weight
641 KB
Volume
34
Category
Article
ISSN
0250-4707

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## Abstract The influence of polymer molecular weight, molecular weight distribution, and polymer‐solvent interactions on the thickness and topography of spin‐coated polymer films was examined. For films prepared from dilute solutions, highly volatile solvents or fair or β€œpoor” solvents for the pol