Influence of oxygen on rate-controlling mechanisms in hot deformation of polycrystalline copper: oxygen-free versus electrolytic grades

Processing maps and rate controlling mec

Processing maps and rate controlling mechanisms of hot deformation of electrolytic tough pitch copper in the temperature range 300–950 °C

✍ Y.V.R.K. Prasad; K.P. Rao 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 521 KB

The hot deformation behavior of electrolytic touch pitch (ETP) copper has been studied in the temperature range 300-950 • C and strain rate range 0.001-100 s -1 using isothermal hot compression tests. Processing maps are developed at different plastic strains with a view to characterize the dynamics