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Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating

โœ Scribed by Dow, Wei-Ping; Yen, Ming-Yao; Lin, Wen-Bing; Ho, Shih-Wei

Book ID
127288202
Publisher
The Electrochemical Society
Year
2005
Tongue
English
Weight
801 KB
Volume
152
Category
Article
ISSN
0013-4651

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Adsorption Equilibrium of Polyethylene G
Adsorption Equilibrium of Polyethylene Glycol in the Copper Electroplating Solution on Activated Carbon
โœ Chiung-Fen Chang; Ching-Yuan Chang; Wen-Tien Tsai; Shian-Chee Wu ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 52 KB

Polyethylene glycol (PEG) used as a brightening and stabilization agent at the concentration of 30 mg dm(-3) is a major organic additive in the copper electroplating solution. Activated carbon, Calgon Filtrasob 400, is used as the adsorbent to remove the PEG from the used electroplating solution in