Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints

✍ Scribed by H. Conrad; Z. Guo; Y. Fahmy; Di Yang

• Publisher: Springer US
• Year: 1999
• Tongue: English
• Weight: 550 KB
• Volume: 28
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-999-0184-x