Ultrafine-grained (UFG) pure Cu exhibits softening compared to coarse-grained (CG) Cu in the steady state of deformation at elevated homologous temperatures below 0.31, while commercially pure UFG Ti does not. The softening of UFG Cu can be explained by the fact that the spacing d 0 of high-angle gr
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Influence of grain boundaries on steady-state deformation resistance of ultrafine-grained Cu
β Scribed by Blum, W. ;Li, Y. J.
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 499 KB
- Volume
- 201
- Category
- Article
- ISSN
- 0031-8965
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