✦ LIBER ✦
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
✍ Scribed by A. Shah; M. Mayer; Y. Zhou; S.J. Hong; J.T. Moon
- Book ID
- 104051997
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 959 KB
- Volume
- 85
- Category
- Article
- ISSN
- 0167-9317
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