In-situ observation and simulation of the solidification process in soldering a small outline package with the Sn-Ag-Cu lead-free alloy

✍ Scribed by Keun-Soo Kim; Motoharu Haga; Katsuaki Suganuma

• Publisher: Springer US
• Year: 2003
• Tongue: English
• Weight: 251 KB
• Volume: 32
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-003-0118-y