In situ functionalized self-assembled monolayer surfaces for selective chemical vapor deposition of copper
β Scribed by Xin Liu; Qi Wang; Liu-Ping Chen
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 797 KB
- Volume
- 255
- Category
- Article
- ISSN
- 0169-4332
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β¦ Synopsis
Recent studies show that the self-assembled monolayer (SAM) is well suited to control the selectivity of chemical vapor deposition (CVD). Here, we reported the selective CVD for copper on the functionalized SAM surfaces (with -SH, -SS-, and -SO 3 H terminal groups). The -SS-and -SO 3 H terminal group surfaces were obtained through in situ chemical transformation of -SH terminal group surface of a 3mercaptopropyltrimethoxysilane-SAM (MPTMS-SAM). As a result, the -SS-terminal group surface reduces copper deposition and the -SO 3 H terminal group surface enhances copper deposition comparing to the -SH terminal group surface. In addition, the MPTMS-SAM was irradiated by UV-light through a photo mask to prepare SH-group and OH-group regions. Then, copper films were deposited only on the SH-group region of the substrate in chemical vapor deposition. Finally, patterns of copper films were formed in the way of UV-light irradiation. These results are expected for use of selective deposition of copper metallization patterns in IC manufacturing processes.
π SIMILAR VOLUMES
Ion-surface reactions involving BBr(n)(+) (n = 0--2) with a fluorinated self-assembled monolayer (F-SAM) surface were investigated using a multi-sector scattering mass spectrometer. Collisions of the B(+) ion yield BF(2)(+) at threshold energy with the simpler product ion BF(+)\* appearing at higher
Adhesive and frictional forces between surfaces modified with self-assembled monolayers (SAMs) and immersed in solvents were measured with chemical force microscopy as functions of surface functionality and solvent. Si/SiO 2 substrates were modified with SAMs of alkylsiloxanes (SiCl 3 (CH 2 ) n -X),