In situ fabrication of photocurable conductive adhesives with silver nano-particles in the absence of capping agent
✍ Scribed by Wen-Tung Cheng; Yu-Wen Chih; Wei-Ting Yeh
- Publisher
- Elsevier Science
- Year
- 2007
- Tongue
- English
- Weight
- 767 KB
- Volume
- 27
- Category
- Article
- ISSN
- 0143-7496
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✦ Synopsis
To increase electrical conductivity and reduce number of processes, this paper aims to fabricate in situ photocurable conductive adhesives with Ag nano-particles in the absence of polymeric protector. The mixture of epoxy-acrylic resin and reactive monomer, as well as AgNO 3 in ethylene glycol, is irradiated by UV light to form silver nano-particles without capping agent and was followed by adding photoinitiator to produce photocurable adhesive with silver nano-particles. In particular, as measured by transmission electron microscopy, the diameter of Ag nano-particle is 30-50 nm for 1 M and 80-90 nm for 2 and 3 M of AgNO 3 , in ethylene glycol. Furthermore, taking 1:1 weight ratio of photosensitive mixture to 3 M of AgNO 3 in ethylene glycol as an example, the surface electrical resistivity of photocurable conductive adhesive may be reduced to 8.803 Â 10 6 (O/&) after exposing to 900 mJ/cm 2 .