The effects of plasma treatment on the surfaces of the flame resistant-4 (FR-4) and copper substrates are investigated in terms of X-ray photoelectron spectroscopy (XPS), contact angle, and atomic force microscopy (AFM). The adhesion strengths of the underfills/FR-4 substrate and underfills/copper s
Impurity effects on adhesion at an interface between NiAl and Mo
โ Scribed by J.E. Raynolds; E.R. Roddick; J.R. Smith; D.J. Srolovitz
- Publisher
- Elsevier Science
- Year
- 1999
- Tongue
- English
- Weight
- 192 KB
- Volume
- 47
- Category
- Article
- ISSN
- 1359-6454
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