✦ LIBER ✦
Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier
✍ Scribed by Seongjun Kim; Keun-Soo Kim; Sun-Sik Kim; Katsuaki Suganuma; Goro Izuta
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 952 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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