Improving the electrical properties of structural epoxy resin adhesives
β Scribed by S.M. Darwish; A. Niazi; A. Ghania; M.E. Kassem
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 897 KB
- Volume
- 11
- Category
- Article
- ISSN
- 0143-7496
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
## Abstract Variations in electrical properties of epoxies during polymerization permit interpretation of molecular changes occuring. Three liquid epoxy resins selected for test were of different molecular weights, varying from 6,400 to 26,800 cycles/sec. Curing agents selected included triethylene
Adhesive properties of different epoxy resins have been evaluated in terms of the lap shear strength using aluminium adherends. Its durability in various humid environments has also been analysed. The fracture mechanisms were determined by ESEM observations. Despite fact that fracture seems macrosco
Nano-sized copoly(styrene-butylacrylate-ethylenglycoldimethacrylate) (St-BA-EGDMA) particles were added at different contents to improve the toughness of diglycidyl ether of bisphenol A epoxy resin (ER) using piperidine as a curing agent. Transmission electron microscopy (TEM) proved that nanoelasto
The improved adhesion of an ultrahigh molecular weight polyethylene (UH-MWPE) fiber to an epoxy from applying polypyrrole (PPy) was investigated using chemical oxidation polymerization. The interfacial shear strength of the PPy-treated fiber/epoxy was enhanced by 280%. Such an improvement was verifi