Improvements of CMP characteristics using slurry filter and high-spray bar of de-ionized water

Advantages of point of use (POU) slurry

Advantages of point of use (POU) slurry filter and high spray method for reduction of CMP process defects

✍ Yong-Jin Seo; Sang-Yong Kim; Woo-Sun Lee 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 560 KB

As integrated circuit devices shrink to smaller dimensions, a chemical mechanical polishing (CMP) process was required for the global planarization of the inter-metal dielectric (IMD) layer with free-defects. However, as the IMD layer gets thinner, micro-scratches are becoming a major defect. Micro-