✦ LIBER ✦
Improvement of Thermal Fatigue Properties of Sn-Ag-Cu Lead-Free Solder Interconnects on Casio’s Wafer-Level Packages Based on Morphology and Grain Boundary Character
✍ Scribed by S. Terashima; T. Kohno; A. Mizusawa; K. Arai; O. Okada; T. Wakabayashi; M. Tanaka; K. Tatsumi
- Book ID
- 107455286
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 362 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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