✦ LIBER ✦
Improvement of adhesion of copper on polyimide by reactive ion-beam etching : Arthur L. Ruoff, Edward J. Kramer and Che-Yu Li. IBM J. Res. Devl. 32, 626 (1988)
- Publisher
- Elsevier Science
- Year
- 1989
- Tongue
- English
- Weight
- 122 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0026-2714
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