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Improvement in the adhesion of polyimide/epoxy joints using various curing agents

✍ Scribed by Seong Hun Kim; Dong Woo Lee; Kyung-Ho Chung; Jae Ki Park; Jae-Yun Jaung; Sung Hoon Jeong

Publisher: John Wiley and Sons
Year: 2002
Tongue: English
Weight: 612 KB
Volume: 86
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.10771

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